Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/04/2011
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Application #:
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12131777
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Filing Dt:
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06/02/2008
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Publication #:
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Pub Dt:
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12/03/2009
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Inventors:
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Chi Keun Vincent Leung, Peng Sun, Xunqing Shi, Chang Hwa Chung
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Title:
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BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, BIO-INFORMATICS CENTRE |
| 2 SCIENCE PARK EAST AVENUE, HONG KONG SCIENCE PARK |
| SHATIN, NEW TERRITORIES, HONG KONG |
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| JAMES D. SHAURETTE |
| WELLS ST. JOHN, P.S. |
| 601 W. 1ST AVE., #1300 |
| SPOKANE, WA 99201 |
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