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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12222176
Filing Dt:
08/04/2008
Publication #:
Pub Dt:
12/17/2009
Inventors:
Chang Sup Ryu, Jun Oh Hwang, Je Gwang Yoo, Jun Heyoung Park, Eung Suek Lee, Jee Soo Mok
Title:
Printed circuit board and method of manufacturing the same
Assignment: 1
Reel/Frame:
021388/0502Recorded: 08/04/2008Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/15/2008
Exec Dt:
07/15/2008
Exec Dt:
07/15/2008
Exec Dt:
07/15/2008
Exec Dt:
07/15/2008
Exec Dt:
07/15/2008
Assignee:
314, MAETAN 3-DONG, YEONGTONG-GU, SUWON
GYUNGGI-DO 443-743, KOREA, REPUBLIC OF
Correspondent:
STAAS & HALSEY LLP
ATTN: DAVID M. PITCHER
1201 NEW YORK AVENUE, N.W., SUITE 700
WASHINGTON, D.C. 20005

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