Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12353275
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Filing Dt:
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01/14/2009
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Publication #:
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Pub Dt:
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12/17/2009
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Inventor:
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Yu-Ren CHEN
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Title:
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Die Rearrangement Package Structure and the Forming Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1. R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM 12, BERMUDA |
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| SINORICA, LLC |
| 528 FALLSGROVE DRIVE |
| ROCKVILLE, MD 20850 |
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