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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/02/2012
Application #:
12481722
Filing Dt:
06/10/2009
Publication #:
Pub Dt:
12/17/2009
Inventor:
Hiroaki Sato
Title:
WAFER POLISHING METHOD AND WAFER PRODUCED THEREBY
Assignment: 1
Reel/Frame:
022806/0192Recorded: 06/10/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/29/2009
Assignee:
2-1, SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN 105-8634
Correspondent:
LOCK SEE YU-JAHNES
FITZPATRICK, CELLA, HARPER & SCINTO
30 ROCKEFELLER PLAZA
NEW YORK, NY 10112

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