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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12165624
Filing Dt:
06/30/2008
Publication #:
Pub Dt:
12/31/2009
Inventors:
Huang Liu, Johnny Widodo, Jeff Shu, Luona Goh Loh Nah, Jack Cheng, Wei Lu, Jingze Tian et al
Title:
INTEGRATED CIRCUIT SYSTEM EMPLOYING A MODIFIED ISOLATION STRUCTURE
Assignment: 1
Reel/Frame:
021175/0584Recorded: 06/30/2008Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/27/2008
Exec Dt:
06/27/2008
Exec Dt:
06/27/2008
Exec Dt:
06/27/2008
Exec Dt:
06/27/2008
Exec Dt:
06/27/2008
Exec Dt:
06/27/2008
Exec Dt:
06/27/2008
Assignee:
60 WOODLANDS INDUSTRIAL PARK D
STREET 2
SINGAPORE 738406, SINGAPORE
Correspondent:
MIKIO ISHIMARU
LAW OFFICES OF MIKIO ISHIMARU
333 W. EL CAMINO REAL, SUITE # 330
SUNNYVALE, CA 94087

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