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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
12217217
Filing Dt:
07/01/2008
Publication #:
Pub Dt:
01/07/2010
Inventors:
Jeffrey F. DeNatale, Philip A. Stupar, Alexandros P. Papavasiliou
Title:
Through-substrate vias and method of fabricating same
Assignment: 1
Reel/Frame:
021245/0511Recorded: 07/01/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/01/2008
Exec Dt:
07/01/2008
Exec Dt:
07/01/2008
Assignee:
P.O. BOX 1085, MAIL CODE A15
THOUSAND OAKS, CALIFORNIA 91358-0085
Correspondent:
STEVEN C. PATRICK
KOPPEL, PATRICK, HEYBL & DAWSON
555 ST. CHARLES DRIVE, SUITE 107
THOUSAND OAKS, CA 91360
Assignment: 2
Reel/Frame:
026637/0433Recorded: 07/22/2011Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/22/2011
Assignee:
1049 CAMINO DOS RIOS
THOUSAND OAKS, CALIFORNIA 91360
Correspondent:
KOPPEL, PATRICK, HEYBL & PHILPOTT
2815 TOWNSGATE ROAD
SUITE 215
WESTLAKE VILLAGE, CA 91361

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