Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12457222
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Filing Dt:
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06/04/2009
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Publication #:
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Pub Dt:
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01/14/2010
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Inventors:
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Bily Wang, Shih-Yu Wu, Chao-Yuan Huang, Ping-Chou Yang, Cheng-Yen Chiang
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Title:
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Led chip package structure using sedimentation and method for making the same
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 18, LANE 522, SEC. 5, JHONGHUA RD. |
HSINCHU CITY, TAIWAN R.O.C. |
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MORTON J. ROSENBERG, ESQ. |
ROSENBERG, KLEIN & LEE |
3458 ELLICOTT CENTER DRIVE, SUITE 101 |
ELLICOTT CITY, MARYLAND 21043 |
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