Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12172431
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Filing Dt:
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07/14/2008
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Publication #:
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Pub Dt:
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01/14/2010
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Inventors:
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Shih-Chuan Wei, Dyi-Chung Hu, Yu-Shan Hu
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Title:
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INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD FOR THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 65, GUANGFU N. RD. |
| HUKOU TOWNSHIP |
| HSINCHU COUNTY, TAIWAN 303 |
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| MICHAEL A. JAFFE |
| 6151 WILSON MILLS RD. |
| HIGHLAND PLACE - SUITE 310 |
| HIGHLAND HEIGHTS, OH 44143 |
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