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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12548114
Filing Dt:
08/26/2009
Publication #:
Pub Dt:
02/04/2010
Inventors:
Heui Jae PARK, Heung Hyun SHIN, Il Hwan LEE
Title:
DETECTING MATERIALS ON WAFER AND REPAIR SYSTEM AND METHOD THEREOF
Assignment: 1
Reel/Frame:
023151/0142Recorded: 08/26/2009Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/25/2009
Exec Dt:
08/25/2009
Exec Dt:
08/25/2009
Assignee:
#201 DONG-A TOWN, 1629-2
BONG-CHUN 7-DONG,GWANAK-GU
SEOUL, KOREA, REPUBLIC OF 152-818
Correspondent:
YONG BEOM HWANG
VOLPE AND KOENIG, P.C.
30 S. 17TH ST., UNITED PLAZA, 18TH FLOOR
PHILADELPHIA, PA 19103

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