Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/21/2012
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Application #:
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12582298
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Filing Dt:
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10/20/2009
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Publication #:
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Pub Dt:
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02/18/2010
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Inventors:
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James W. Adkisson, Jeffrey P. Gambino, Mark D. Jaffe, Richard L. Rassel
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Title:
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BOND PAD FOR WAFER AND PACKAGE FOR CMOS IMAGER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 LIME TREE BAY AVENUE |
| SUITE #4-210, GOVERNORS SQUARE |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1209 |
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| ERIC KARICH |
| 20 CRESTVIEW |
| ALISO VIEJO, CA 92656 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21 HUNG TO ROAD |
| RM F, 10/F, INFO TECH CENTRE |
| KWUN TONG, KOWLOON, HONG KONG |
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| ERIC KARICH |
| 20 CRESTVIEW |
| ALISO VIEJO, CA 92656 |
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