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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/07/2012
Application #:
12325005
Filing Dt:
11/28/2008
Publication #:
Pub Dt:
02/25/2010
Inventors:
Hung-Ching LAI, Kuo-Hsiung Li, Hui-Hsuan Chen, Wei-Chung Wang
Title:
SENSING MODULE
Assignment: 1
Reel/Frame:
021899/0238Recorded: 11/28/2008Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/03/2008
Exec Dt:
11/03/2008
Exec Dt:
11/03/2008
Exec Dt:
11/07/2008
Assignee:
5F, NO.5, INNOVATION ROAD I, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN
Correspondent:
CHUN-MING SHIH
13611 NORTHBOURNE DR.
CENTREVILLE, VA 20120
Assignment: 2
Reel/Frame:
040212/0035Recorded: 11/03/2016Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/24/2016
Assignee:
ONE MICROSOFT WAY
REDMOND, WASHINGTON 98052
Correspondent:
CPA GLOBAL LTD
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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