Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12405043
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Filing Dt:
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03/16/2009
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Publication #:
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Pub Dt:
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02/25/2010
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Inventors:
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Chun-Hung Lin, Pao-Huei Chang Chien, Ping-Cheng Hu, Wei-Lun Cheng
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Title:
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ADVANCED QUAD FLAT NON-LEADED PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26, CHIN 3RD. RD., 811, NANTZE EXPORT |
PROCESSING ZONE |
KAOHSIUNG, TAIWAN R.O.C. |
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J. C. PATENTS |
4 VENTURE, SUITE 250 |
IRVINE, CA 92618 |
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