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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
12373881
Filing Dt:
09/23/2009
Publication #:
Pub Dt:
03/04/2010
Inventors:
Guo-Qiang Lo, Lakshmi Kanta Bera, Li-Hui Guo, Wei-Yip Loh, Ebin Liao, Xiaowu Zhang
Title:
METHOD FOR STRAINING A SEMICONDUCTOR WAFER AND A WAFER SUBSTRATE UNIT USED THEREIN
Assignment: 1
Reel/Frame:
023275/0523Recorded: 09/23/2009Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/23/2009
Exec Dt:
04/11/2009
Exec Dt:
06/16/2009
Exec Dt:
03/25/2009
Exec Dt:
03/23/2009
Exec Dt:
03/23/2009
Assignee:
1 FUSIONOPOLIS WAY, #20-10
CONNEXIS
SINGAPORE, SINGAPORE 138632
Correspondent:
WILLIAM T. CHRISTIANSEN, PH.D.
SEED IP LAW GROUP PLLC
701 FIFTH AVENUE, SUITE 5400
SEATTLE, WA 98104

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