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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7989939
Issue Dt:
08/02/2011
Application #:
12549033
Filing Dt:
08/27/2009
Publication #:
20100052130
Pub Dt:
03/04/2010
Inventors:
HYUN-IK HWANG, YONG-JIN JUNG, KUNHO SONG
Title:
SEMICONDUCTOR PACKAGE WHICH INCLUDES AN INSULATING LAYER LOCATED BETWEEN PACKAGE SUBSTRATES WHICH MAY PREVENT AN ELECTRICAL SHORT CAUSED BY A BONDING WIRE
Assignment: 1
Reel/Frame:
023158/0303Recorded: 08/27/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HWANG, HYUN-IK
Exec Dt:
08/10/2009
JANG, YONGJIN
Exec Dt:
08/10/2009
SONG, KUNHO
Exec Dt:
08/10/2009
Assignee:
SAMSUNG ELECTRONICS CO., LTD
416, MAETAN-DONG
YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
FRANK CHAU
130 WOODBURY ROAD
WOODBURY, NY 11797
Assignment: 2
Reel/Frame:
023302/0821Recorded: 09/30/2009Pages: 3
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE NAME OF AN ASSIGNOR PREVIOUSLY RECORDED ON REEL 023158 FRAME 0303. ASSIGNOR(S) HEREBY CONFIRMS THE CORRECT THE NAME OF ASSIGNOR YONGJIN JANG TO YONGJIN JUNG.
Assignors:
HWANG, HYUN-IK
Exec Dt:
08/10/2009
JUNG, YONGJIN
Exec Dt:
08/10/2009
SONG, KUNHO
Exec Dt:
08/10/2009
Assignee:
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU,
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
F. CHAU & ASSOCIATES, LLC
130 WOODBURY ROAD
WOODBURY, NY 11797

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