Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/17/2011
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Application #:
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12434772
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Filing Dt:
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05/04/2009
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Publication #:
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Pub Dt:
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03/11/2010
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Inventors:
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John R. Martin, Timothy J. Frey, Christine H. Tsau
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Title:
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APPARATUS AND METHOD OF WAFER BONDING USING COMPATIBLE ALLOY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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ONE TECHNOLOGY WAY |
NORWOOD, MASSACHUSETTS 02062-9106 |
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STEVEN G. SAUNDERS |
BROMBERG & SUNSTEIN LLP, 125 SUMMER ST. |
BOSTON, MA 02110-1618 |
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