Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
12307564
|
Filing Dt:
|
09/04/2009
|
Publication #:
|
|
Pub Dt:
|
03/18/2010
| | | | |
Inventors:
|
Masaru Tanaka, Jun Taketatsu
|
Title:
|
CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU |
TOKYO, JAPAN 163-0449 |
|
|
|
GRIFFIN & SZIPL, PC |
SUITE PH-1 |
2300 NINTH STREET, SOUTH |
ARLINGTON, VA 22204 |
|
|
Search Results as of:
05/13/2024 03:04 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|