Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12476221
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Filing Dt:
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06/01/2009
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Publication #:
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Pub Dt:
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04/29/2010
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Inventors:
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Tae Soo LEE, Yun Hwi Park, Yun Hee Cho
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Title:
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SEMICONDUCTOR MULTI-CHIP PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 314 MAETAN 3-DONG, YEONGTONG-GU |
| SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF |
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| MCDERMOTT WILL & EMERY LLP |
| 18191 VON KARMAN AVE. |
| SUITE 500 |
| IRVINE, CA 92612-7108 |
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