Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/06/2011
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Application #:
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12475362
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Filing Dt:
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05/29/2009
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Publication #:
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Pub Dt:
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04/29/2010
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Inventors:
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Lily Khor, Yong Lam Wai, Lau Choon Keong
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Title:
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WAFER LEVEL PACKAGE USING STUD BUMP COATED WITH SOLDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| S-SITE, LOT 52986 TAMAN MERU INDUSTRIAL ESTATE |
| JELAPANG, P.O. BOX 380, IPOH |
| PERAK DARUL RIDZUAN, MALAYSIA 30720 |
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| WILLIAM L. SHAFFER |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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