Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12358627
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Filing Dt:
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01/23/2009
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Publication #:
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Pub Dt:
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05/20/2010
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Inventor:
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CHUNG HSING TZU
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Title:
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FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 3321, ROAD TOWN |
| TORTOLA, VIRGIN ISLANDS, BRITISH |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE-SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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