Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/02/2012
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Application #:
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12330143
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Filing Dt:
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12/08/2008
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Publication #:
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Pub Dt:
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06/10/2010
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Inventor:
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Jing-en Luan
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Title:
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MANUFACTURING METHOD OF CHIP PACKAGE WITH COPLANARITY CONTROLLING FEATURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO |
| INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| JASON T. EVANS |
| 701 FIFTH AVENUE |
| SUITE 5400 |
| SEATTLE, WA 98104 |
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