Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/10/2012
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Application #:
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12331154
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Filing Dt:
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12/09/2008
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Publication #:
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Pub Dt:
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06/10/2010
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Inventor:
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Longqiang Zu
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Title:
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METHOD AND STRUCTURE FOR ADAPTING SOLDER COLUMN TO WARPED SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 R.O.C. |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE PLEASE CORRECT THE RECEIVING PARTY DATA TO ADD GLOBAL UNICHIP CORP. PREVIOUSLY RECORDED ON REEL 021949 FRAME 0688. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 R.O.C. |
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| NO. 10, LI-HSIN 6TH ROAD |
| HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 300 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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