Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12604232
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Filing Dt:
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10/22/2009
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Publication #:
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Pub Dt:
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06/17/2010
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Inventors:
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Dong Hee Kim, Hyun Oh Yoo, Hyun Woo Lee
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Title:
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Semiconductor Package Having Support Chip And Fabrication Method Thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 95-1, WONNAM-RI, EUMBONG-MYEON |
| CHUNGCHEONGNAMDO |
| ASAN-SI, KOREA, REPUBLIC OF 336-864 |
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| SUN Y. PAE |
| 2215 PERRYGREEN WAY |
| REINHART BOERNER VAN DEUREN P.C. |
| ROCKFORD, IL 61107 |
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