Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/06/2011
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Application #:
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12385637
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Filing Dt:
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04/15/2009
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Publication #:
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Pub Dt:
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06/17/2010
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Inventors:
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Cheng-Ho HSU, Kuei-Hua LIU
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Title:
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PACKAGE MODULE FOR A MEMORY IC CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 118, CHUNG-HUA RD. |
| CHU-NAN, MIAO-LI 35053, TAIWAN R.O.C. |
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| BACON & THOMAS, PLLC |
| 625 SLATERS LANE |
| FOURTH FLOOR |
| ALEXANDRIA, VA 22314-1176 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| NO.118, ZHONGHUA RD. |
| DING-PU VIL., ZHUNAN TOWNSHIP |
| MIAOLI COUNTY, TAIWAN 350 |
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| JONATHAN P SOIFER |
| SANDBERG PHOENIX & VON GONTARD, P.C. |
| 120 S. CENTRAL AVE., SUITE 1600 |
| CLAYTON, MO 63105 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| NO.81, SEC. 2, GONGDAO 5TH RD. |
| PUDING VIL., EAST DIST. |
| HSINCHU CITY, TAIWAN 30070 |
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| JONATHAN P SOIFER |
| SANDBERG PHOENIX & VON GONTARD, P.C. |
| 120 S. CENTRAL AVE., SUITE 1600 |
| CLAYTON, MO 63105 |
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