Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/15/2011
|
Application #:
|
12715778
|
Filing Dt:
|
03/02/2010
|
|
Publication #:
|
|
Pub Dt:
|
06/24/2010
| | | | |
|
Inventors:
|
Geng-Shin SHEN, Yu-Ren Chen
|
|
Title:
|
CHIP PACKAGE STRUCTURE AND THE METHOD THEREOF WITH ADHERING THE CHIPS TO A FRAME AND FORMING UBM LAYERS
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| NO.1, R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
|
|
|
| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON, BERMUDA 12 |
|
|
|
|
| SINORICA, LLC |
| 2275 RESEARCH BLVD. |
| SUITE 500 |
| ROCKVILLE, MD 20850 |
|
|
Search Results as of:
05/30/2024 11:30 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
