Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/24/2011
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Application #:
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12453273
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Filing Dt:
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05/05/2009
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Publication #:
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Pub Dt:
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06/24/2010
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Inventors:
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Jin Gu Kim, Young Do Kweon, Hyung Jin Jeon, Hee Kon Lee, Seon Hee Moon, Seung Wook Park
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Title:
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METHOD OF MANUFACTURING WAFER LEVEL PACKAGE INCLUDING COATING AND REMOVING RESIN OVER THE DICING LINES
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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314 MAETAN 3-DONG, YEONGTONG-GU |
SUWON, GYUNGGI-DO, KOREA, REPUBLIC OF 443-743 |
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STAAS & HALSEY LLP |
ATTENTION: DAVID M. PITCHER |
1201 NEW YORK AVE., N.W., SUITE 700 |
WASHINGTON, D.C. 20005 |
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