Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/28/2014
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Application #:
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12376425
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Filing Dt:
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07/10/2009
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Publication #:
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Pub Dt:
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07/01/2010
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Inventors:
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Siegfried Herrmann, Berthold Hahn
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Title:
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Thin-Film Semiconductor Component and Component Assembly
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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LEIBNIZSTRASSE 4 |
REGENSBURG, GERMANY 93055 |
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COHEN, PONTANI, LIEBERMAN & PAVANE LLP |
551 FIFTH AVENUE |
SUITE 1210 |
NEW YORK, NY 10176 |
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