Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12578382
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Filing Dt:
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10/13/2009
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Publication #:
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Pub Dt:
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07/29/2010
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Inventors:
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Yonggang JIN, Kiyoshi Kuwabara, Xavier Baraton
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Title:
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INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5A, SERANGOON NORTH AVENUE 5 |
| SINGAPORE, SINGAPORE 554574 |
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| HOGAN & HARTSON LLP |
| ONE TABOR CENTER |
| 1200 SEVENTEENTH STREET, SUITE 1500 |
| DENVER, CO 80202 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 023365 FRAME 0789. ASSIGNOR(S) HEREBY CONFIRMS THE STMICROELECTRONICS ASIA PACIFIC PTE LTD SHOULD BE STMICROELECTRONICS PTE LTD.
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| HOGAN LOVELLS US LLP |
| TWO NORTH CASCADE AVENUE, SUITE 1300 |
| COLORADO SPRINGS, CO 80903 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 ANG MO KIO INDUSTRIAL PARK 2 |
| SINGAPORE, SINGAPORE 569508 |
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| HOGAN LOVELLS US LLP |
| ONE TABOR CENTER |
| 1200 17TH STREET, SUITE 1500 |
| DENVER, CO 80202 |
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