Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/29/2012
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Application #:
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12691478
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Filing Dt:
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01/21/2010
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Publication #:
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Pub Dt:
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07/29/2010
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Inventors:
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Kuo-Hua Chen, Kuo-Pin Yang
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Title:
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SILICON SUBSTRATE HAVING THROUGH VIAS AND PACKAGE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD RD. |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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MCCRACKEN & FRANK LLP |
311 S. WACKER DRIVE |
SUITE 2500 |
CHICAGO, IL 60606 |
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