Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/13/2011
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Application #:
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11657733
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Filing Dt:
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01/25/2007
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Publication #:
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Pub Dt:
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09/02/2010
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Inventor:
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Chien-Hung Liu
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Title:
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PHOTOSENSITIZING CHIP PACKAGE & MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4FL., NO. 25, JI-LIN RD., CHUNG-LI INDUSTRY PARK |
| TAOYUAN HSIEN, TAIWAN R.O.C. |
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| TROXELL LAW OFFICE PLLC |
| 5205 LEESBURG PIKE |
| SUITE 1404 |
| FALLS CHURCH, VA 22041-3401 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9F., NO. 23, JILIN RD., JHONGLI INDUSTRIAL PARK |
| TAOYUAN COUNTY |
| JHONGLI CITY, TAIWAN 32062 |
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| WEN LIU |
| 444 S. FLOWER STREET, SUITE 1750 |
| LOS ANGELES, CA 90071 |
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