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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/30/2011
Application #:
12399083
Filing Dt:
03/06/2009
Publication #:
Pub Dt:
09/09/2010
Inventors:
Paul Alan McConnelee, Kevin M. Durocher, Donald Paul Cunningham
Title:
SYSTEM AND METHOD FOR STACKED DIE EMBEDDED CHIP BUILD-UP
Assignment: 1
Reel/Frame:
022356/0107Recorded: 03/06/2009Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/02/2009
Exec Dt:
03/02/2009
Exec Dt:
03/03/2009
Assignee:
1 RIVER ROAD
SCHENECTADY, NEW YORK 12345
Correspondent:
ZIOLKOWSKI PATENT SOLUTIONS GROUP, SC
136 SOUTH WISCONSIN STREET
PORT WASHINGTON, WI 53074

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