Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12305794
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Filing Dt:
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12/19/2008
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Publication #:
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Pub Dt:
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09/16/2010
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Inventors:
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Seiji Yamada, Kenichiro Sugimori
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Title:
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LEAD-FREE SOLDER ALLOY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ART VILLAGE OSAKI CENTRAL TOWER 1-2-2, OSAKI, SHINAGAWA-KU, |
| TOKYO, JAPAN 1418634 |
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| 487, SEKIYADOMOTOMACHI, |
| NODA-CITY CHIBA, JAPAN 2700203 |
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| KRATZ, QUINTOS & HANSON, LLP |
| 1420 K STREET, N.W. SUITE 400 |
| WASHINGTON, DC 20005 |
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