Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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01/13/2015
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Application #:
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12729682
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Filing Dt:
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03/23/2010
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Publication #:
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Pub Dt:
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09/30/2010
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Inventors:
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Philipp STEINMANN, Manfred SCHIEKOFER, Michael KRAUS, Thomas SCHARNAGL et al
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Title:
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Method of Forming an Electrical Contact Between a Support Wafer and the Surface of a Top Silicon Layer of a Silicon-on-Insulator Wafer and an Electrical Device Including Such an Electrical Contact
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HAGGERTYSTRASSE 1 |
| FREISING, GERMANY 85356 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P O BOX 655474, M/S 3999 |
| DALLAS, TX 75265 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE "BEATE BEUERMANN" LISTED UNDER CONVEYING PARTY. HE IS NOT ONE OF THE INVENTORS. PREVIOUSLY RECORDED ON REEL 024487 FRAME 0695. ASSIGNOR(S) HEREBY CONFIRMS THE PATENT (12/729,682) PREVIOUS ASSIGNMENT..
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| HAGGERTYSTRASSE 1 |
| FREISING, GERMANY 85356 |
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| TEXAS INSTRUMENTS INCORPORATED |
| 12500 TI BOULEVARD - M/S 3999 |
| DALLAS, TX 75243 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12500 TI BOULEVARD |
| DALLAS, TEXAS 75243 |
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| TEXAS INSTRUMENTS INCORPORATED |
| P. O. BOX 655474, MAIL STATION 399 |
| DALLAS, TX 75265-5474 |
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