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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8461614
Issue Dt:
06/11/2013
Application #:
12753371
Filing Dt:
04/02/2010
Publication #:
20100258838
Pub Dt:
10/14/2010
Inventors:
Wen-Chung Chiang, Keng-Chung Wu, Ying-Chi Hsieh, Cheng-Kang Lu, Ming-Huang Fu
Title:
PACKAGING SUBSTRATE DEVICE, METHOD FOR MAKING THE PACKAGING SUBSTRATE DEVICE, AND PACKAGED LIGHT EMITTING DEVICE
Assignment: 1
Reel/Frame:
024180/0339Recorded: 04/02/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHIANG, WEN-CHUNG
Exec Dt:
03/14/2010
WU, KENG-CHUNG
Exec Dt:
03/14/2010
HSIEH, YING-CHI
Exec Dt:
03/14/2010
LU, CHENG-KANG
Exec Dt:
03/14/2010
FU, MING-HUANG
Exec Dt:
03/14/2010
Assignee:
HIGH CONDUCTION SCIENTIFIC CO., LTD.
NO. 3-1, LANE 108, SEC. 1, NANSHAN RD.
LUJHU TOWNSHIP, TAOYUAN, TAIWAN 33861
Correspondent:
SUSAN C. DINICOLA
10 FAWCETT STREET
OCCHIUTI ROHLICEK & TSAO, LLP
CAMBRIDGE, MA 02138
Assignment: 2
Reel/Frame:
028866/0945Recorded: 08/29/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HIGH CONDUCTION SCIENTIFIC CO., LTD.
Exec Dt:
08/08/2012
Assignee:
TONG HSING ELECTRONIC INDUSTRIES, LTD.
6TH FL., NO. 83, YENPING S. RD.
TAIPEI CITY, TAIWAN 100
Correspondent:
Y. ROCKY TSAO
321 SUMMER STREET
2ND FLOOR
BOSTON, MA 02210

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