Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/05/2012
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Application #:
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12583725
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Filing Dt:
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08/24/2009
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Publication #:
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Pub Dt:
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11/18/2010
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Inventors:
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Chun-Kai Liu, Chih-Kuang Yu, Ming-Ji Dai, Ming-Che Hsieh
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Title:
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STACKED-CHIP PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 195, SEC. 4, CHUNG HSING RD. |
| CHUTUNG, HSINCHU 31040, TAIWAN R.O.C. |
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| J. C. PATENTS |
| 4, VENTURE SUITE 250 |
| IRVINE, CA 92618 |
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