Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12856968
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Filing Dt:
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08/16/2010
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Publication #:
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Pub Dt:
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12/02/2010
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Inventors:
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BILY WANG, JONNIE CHUANG, CHUAN-FA LIN, CHI-WEN HUNG
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Title:
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WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 18, LANE 522, SEC. 5, CHUNG HUA RD. |
| HSIN CHU CITY, TAIWAN R.O.C. |
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| ROSENBERG, KLEIN & LEE |
| 3458 ELLICOTT CENTER DRIVE-SUITE 101 |
| ELLICOTT CITY, MD 21043 |
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