Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
02/05/2013
|
Application #:
|
12779800
|
Filing Dt:
|
05/13/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/16/2010
| | | | |
|
Inventors:
|
Shih-Fu Huang, Yuan-Chang Su, Chia-Cheng Chen, Kuang-Hsiung Chen, Ta-Chun Lee
|
|
Title:
|
SUBSTRATE HAVING SINGLE PATTERNED METAL LAYER EXPOSING PATTERNED DIELECTRIC LAYER, CHIP PACKAGE STRUCTURE INCLUDING THE SUBSTRATE, AND MANUFACTURING METHODS THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 26 CHIN 3RD ROAD |
| NANTZE EXPORT PROCESSING ZONE |
| KAOSIUNG, TAIWAN |
|
|
|
|
| COOLEY LLP |
| 777 SIXTH STREET N.W. |
| SUITE 1100 |
| WASHINGTON, DC 20001 |
|
|
Search Results as of:
06/15/2024 09:28 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
