Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12810989
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Filing Dt:
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10/04/2010
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Publication #:
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Pub Dt:
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01/13/2011
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Inventors:
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Tomoyuki Takada, Sadanori Yamanaka, Taketsugu Yamamoto, Kazumi Wada, Masahiko Hata
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Title:
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SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-1, HONGO 7-CHOME |
| BUNKYO-KU, TOKYO, JAPAN 113-8654 |
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| SUGHRUE, MION |
| 2100 PENNSYLVANIA AVE, NW |
| WASHINGTON, DC 20037 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 27-1, SHINKAWA 2-CHOME |
| CHUO-KU, TOKYO, JAPAN 104-8260 |
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| SUGHRUE, MION |
| 2100 PENNSYLVANIA AVE, NW |
| WASHINGTON, DC 20037 |
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