Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/10/2013
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Application #:
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12922688
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Filing Dt:
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09/15/2010
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Publication #:
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Pub Dt:
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02/03/2011
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Inventors:
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Hironori Maruyama, Hitoshi Kawaguchi, Hiroyuki Tanaka
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Title:
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MULTILAYER CIRCUIT BOARD, INSULATING SHEET, AND SEMICONDUCTOR PACKAGE USING MULTILAYER CIRCUIT BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-8, HIGASHI-SHINAGAWA 2-CHOME, SHINAGAWA-KU |
| TOKYO, JAPAN 1400002 |
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| MASAYASU MORI |
| 918 PRINCE STREET |
| ALEXANDRIA, VA 22314 |
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