Patent Assignment Abstract of Title
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Total Assignments:
5
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Patent #:
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Issue Dt:
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10/16/2012
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Application #:
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12923872
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Filing Dt:
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10/13/2010
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Publication #:
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Pub Dt:
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02/03/2011
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Inventors:
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John S. Foster, Alok Paranjpye, Douglas L. Thompson
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Title:
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WAFER LEVEL HERMETIC BOND USING METAL ALLOY WITH KEEPER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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75 ROBIN HILL ROAD |
GOLETA, CALIFORNIA 93117 |
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JAQUELIN K. SPONG |
2139 DOMINION WAY |
FALLS CHURCH, VA 22043 |
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Assignment:
2
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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812 ANACAPA STREET, SUITE A |
SANTA BARBARA, CALIFORNIA 93101 |
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PATTY CHENG |
2625 MIDDLEFIELD ROAD, SUITE 215 |
PALO ALTO, CA 94306 |
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Assignment:
3
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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406 BLACKWELL STREET |
SUITE 240 |
DURHAM, NORTH CAROLINA 27701 |
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PACIFIC WESTERN BANK |
406 BLACKWELL STREET |
SUITE 240 |
DURHAM, NC 27701 |
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Assignment:
4
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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75 ROBIN HILL ROAD |
GOLETA, CALIFORNIA 93117 |
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PATTY CHENG |
2625 MIDDLEFIELD RD., #215 |
PALO ALTO, CA 94306 |
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Assignment:
5
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RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
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75 ROBIN HILL ROAD |
GOLETA, CALIFORNIA 93117 |
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PACIFIC WESTERN BANK |
406 BLACKWELL STREET |
SUITE 240 |
DURHAM, NC 27701 |
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