Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12581176
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Filing Dt:
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10/19/2009
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Publication #:
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Pub Dt:
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03/03/2011
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Inventors:
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YI-SHIH HSIEH, JIN-JUN RAO
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Title:
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HEAT DISSIPATION DEVICE HAVING FIN ASSEMBLY AND HEAT PIPE SOLDERED IN HOLE DEFINED IN THE FIN ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 635 FOXCONN ROAD, HI-TECH INDUSTRY PARK,DEVELOPMENT DISTRICT |
KUNSHAN CITY, JIANGSU PROVINCE, CHINA |
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3-2,CHUNG SHAN ROAD |
TU-CHENG,TAIPEI HSIEN, TAIWAN |
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FRANK R. NIRANJAN |
288 SOUTH MAYO AVENUE |
CITY OF INDUSTRY, CA 91789 |
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