Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
11/20/2012
|
Application #:
|
12547495
|
Filing Dt:
|
08/26/2009
|
Publication #:
|
|
Pub Dt:
|
03/03/2011
| | | | |
Inventor:
|
Jun-Chung Hsu
|
Title:
|
SOLDER PAD STRUCTURE WITH HIGH BONDABILITY TO SOLDER BALL
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 1245, JUNGHUA RD. |
SHIN-WU SHIANG |
TAOYUAN, TAIWAN |
|
|
|
LIN & ASSOCIATES INTELLECTUAL PROPERTY, |
P.O. BOX 2339 |
SARATOGA, CA 95070-0339 |
|
|
Search Results as of:
06/16/2024 05:08 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|