Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/25/2013
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Application #:
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12583949
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Filing Dt:
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08/28/2009
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Publication #:
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Pub Dt:
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03/03/2011
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Inventors:
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Meng-Jen Wang, Kuo-Pin Yang
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Title:
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METHOD FOR FORMING A VIA IN A SUBSTRATE AND SUBSTRATE WITH A VIA
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD RD. |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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MCCRACKEN & FRANK LLP |
311 S. WACKER DRIVE |
SUITE 2500 |
CHICAGO, IL 60606 |
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