Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/20/2014
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Application #:
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12872966
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Filing Dt:
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08/31/2010
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Publication #:
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Pub Dt:
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03/31/2011
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Inventors:
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Tadahiro MORIFUJI, Haruo Shimamoto, Chuichi Miyazaki, Toshihide Uematsu, Yoshiyuki Abe
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MULTILAYER WAFER STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 21, SAIIN MIZOSAKI-CHO, UKYO-KU, KYOTO-SHI |
| KYOTO 615-8585, JAPAN |
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| 1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, 211-8668, JAPAN |
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| RABIN & BERDO, P.C. |
| 1101 14TH STREET, N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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Assignment:
2
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD |
| SUITE 210 |
| ALEXANDRIA, VA 22314 |
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