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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/20/2012
Application #:
12600410
Filing Dt:
12/01/2010
Publication #:
Pub Dt:
04/21/2011
Inventors:
Hisao Ishikawa, Masanori Yokoyama
Title:
PRODUCTION METHOD AND PRODUCTION APPARATUS OF TIN OR SOLDER ALLOY FOR ELECTRONIC COMPONENTS, AND SOLDER ALLOY
Assignment: 1
Reel/Frame:
025435/0009Recorded: 12/01/2010Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/11/2010
Exec Dt:
08/11/2010
Assignee:
3-9 TENMA-CHOU
UTSUNOMIYA CITY, TOCHIGI, JAPAN 3200035
Correspondent:
COOK ALEX LTD
SUITE 2850
200 WEST ADAMS STREET
CHICAGO, IL 60606
Assignment: 2
Reel/Frame:
033618/0377Recorded: 08/27/2014Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/23/2014
Assignee:
1100 SHIOBARA
NASUSHIOBARA CITY, TOCHIGI, JAPAN 3292921
Correspondent:
HUSCH BLACKWELL LLP
120 SOUTH RIVERSIDE PLAZA, SUITE 2200
CHICAGO, IL 60606

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