Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/09/2012
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Application #:
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12710804
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Filing Dt:
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02/23/2010
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Publication #:
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Pub Dt:
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05/05/2011
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Inventor:
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Do-Young KIM
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Title:
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CHIP ON FILM TYPE SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 HYANGJEONG-DONG, HEUNGDUK-GU, CHEONGJU-SI |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF 361-725 |
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| COLLIN PARK |
| 1111 PENNSYLVANIA AVE. NW |
| MORGAN LEWIS & BOCKIUS LLP |
| WASHINGTON, DC 20004 |
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Assignment:
2
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 15F, 76 JIKJI-DAERO, 436BEON-GIL (JIKJI SMART TOWER), HEUNGDEOK-GU, CHUNGCHEONGBUK-DO |
| CHEONGJU-SI, KOREA, REPUBLIC OF 28581 |
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| NSIP LAW |
| P.O. BOX 65745 |
| WASHINGTON, DC 20035 |
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