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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8659155
Issue Dt:
02/25/2014
Application #:
12846353
Filing Dt:
07/29/2010
Publication #:
20110101527
Pub Dt:
05/05/2011
Inventors:
Ming-Da CHENG, Wen-Hsiung LU, Chih-Wei LIN, Ching-Wen CHEN, Chung-Shi LIU, Ming-Che HO et al
Title:
MECHANISMS FOR FORMING COPPER PILLAR BUMPS
Assignment: 1
Reel/Frame:
024761/0918Recorded: 07/29/2010Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CHENG, MING-DA
Exec Dt:
07/25/2010
LU, WEN-HSIUNG
Exec Dt:
07/25/2010
LIN, CHIH-WEI
Exec Dt:
07/25/2010
CHEN, CHING-WEN
Exec Dt:
07/26/2010
WU, YI-WEN
Exec Dt:
07/26/2010
CHANG, CHIA-TUNG
Exec Dt:
07/26/2010
HO, MING-CHE
Exec Dt:
07/26/2010
LIU, CHUNG-SHI
Exec Dt:
07/26/2010
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300
Correspondent:
LOWE HAUPTMAN HAM & BERNER, LLP (TSMC)
1700 DIAGONAL ROAD, SUITE 300
ALEXANDRIA, VA 22314

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