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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/10/2011
Application #:
11867051
Filing Dt:
10/04/2007
Publication #:
Pub Dt:
05/12/2011
Inventors:
Kejun Zeng, Wei Qun Peng, Rebecca L. Holford, Robert John Furtaw, Bernardo Gallegos
Title:
STABLE GOLD BUMP SOLDER CONNECTIONS
Assignment: 1
Reel/Frame:
020021/0049Recorded: 10/26/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/04/2007
Exec Dt:
10/04/2007
Exec Dt:
10/07/2007
Exec Dt:
10/07/2007
Exec Dt:
10/04/2007
Assignee:
7839 CHURCHILL WAY
MS 3999
DALLAS, TEXAS 75251
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
7839 CHURCHILL WAY
MS 3999
DALLAS, TX 75251

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