Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12951665
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Filing Dt:
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11/22/2010
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Publication #:
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Pub Dt:
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05/26/2011
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Inventors:
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Dong Young JANG, Seok-Kee HONG, Ho-Jin HWANG, Young-Hwan LIM, Chang-Woo BAN, Si-Eun YANG
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Title:
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INSPECTION METHOD FOR BONDED WAFER USING LASER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 172 GONGNEUNG-DONG, NOWON-GU, |
| SEOUL, KOREA, REPUBLIC OF |
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| IPLA P.A. |
| 3550 WILSHIRE BLVD. |
| 17TH FLOOR |
| LOS ANGELES, CA 90010 |
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