Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/16/2014
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Application #:
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13002449
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Filing Dt:
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01/03/2011
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Publication #:
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Pub Dt:
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06/02/2011
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Inventors:
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Daisuke Furukawa, Kazumasa Asai, Takahiro Kida, Tadao Tanaka
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Title:
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WAFER POLISHING METHOD AND DOUBLE-SIDE POLISHING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-2, OHTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN |
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| WILLIAM P. BERRIDGE |
| OLIFF & BERRIDGE, PLC |
| P.O. BOX 320850 |
| ALEXANDRIA, VA 22320-4850 |
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