Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/05/2013
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Application #:
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12903116
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Filing Dt:
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10/12/2010
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Publication #:
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Pub Dt:
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06/30/2011
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Inventors:
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HUNG-CHIN LIN, KUO-FU PENG, CHIEN-MIN CHEN, KO-WEI CHIEN
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Title:
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SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 13, GONGYE 5TH RD., HSINCHU INDUSTRIAL PARK,HUKOU SHIANG |
HSINCHU HSIEN 303, TAIWAN |
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RAYMOND J. CHEW |
288 SOUTH MAYO AVENUE |
CITY OF INDUSTRY, CA 91789 |
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